Write a Blog >>
TechDebt 2021
Wed 19 - Fri 21 May 2021
co-located with ICSE 2021
Wed 19 May 2021 17:00 - 17:20 at TechDebt Room - TD Characteristics and Contexts Chair(s): Apostolos Ampatzoglou

Complexity of products, volatility in global markets, and the increasingly rapid pace of innovations may make it difficult to know how to approach challenging situations in mechatronic design and production. Technical Debt (TD) is a metaphor that describes the practical bargain of exchanging short-term benefits for long-term negative consequences. Oftentimes, the scope and impact of TD, as well as the cost of corrective measures, are underestimated. Especially for mechatronic teams in the mechanical, electrical, and software disciplines, the adverse interdisciplinary ripple effects of TD incidents are passed on throughout the life cycle. The analysis of the first comprehensive survey showed that not only do the TD types differ in cross-disciplinary comparisons, but different characteristics can also be observed depending on whether a discipline is studied in isolation or in combination with others. To validate the study results and to report on a general consciousness of TD in the disciplines, this follow-up study involves 15 of the 50 experts of the predecessor study and reflects the frequency and impact of technical debt in industrial experts’ daily work using a questionnaire. These experts rate 14 TD types, 47 TD causes, and 33 TD symptoms in terms of their frequency and impact. Detailed analyses reveal consistent results for the most frequent TD types and causes, yet they show divergent characteristics in a profound exploration of discipline-specific phenomena. Thus, this study has the potential to set the foundations for future automated TD identification analyses in mechatronics.

Conference Day
Wed 19 May

Displayed time zone: Amsterdam, Berlin, Bern, Rome, Stockholm, Vienna change

17:00 - 17:50
TD Characteristics and ContextsTechnical Papers at TechDebt Room
Chair(s): Apostolos AmpatzoglouUniversity of Macedonia
Frequency and Impact of Technical Debt Characteristics in Companies Producing Mechatronic Products
Technical Papers
Fandi BiTechnical University of Munich, Birgit Vogel-HeuserKarlsruhe Institute of Technology, Litong Xu
Pre-print Media Attached File Attached
Impact of Opportunistic Reuse Practices to Technical Debt
Technical Papers
Rafael CapillaUniversidad Rey Juan Carlos, Tommi MikkonenUniversity of Helsinki, Carlos CarrilloTechnical University of Madrid, Francesca Arcelli FontanaUniversity of Milano - Bicocca, Ilaria PigazziniUniversity of Milano-Bicocca, Valentina LenarduzziLUT University
File Attached
Security Debt: Characteristics, Product Life-Cycle Integrations and Items
Technical Papers

Information for Participants
Info for TechDebt Room: