Write a Blog >>
TechDebt 2021
Wed 19 - Fri 21 May 2021
co-located with ICSE 2021
Wed 19 May 2021 17:20 - 17:40 at TechDebt Room - TD Characteristics and Contexts Chair(s): Apostolos Ampatzoglou

Technical debt (TD) has been recognized as an important quality problem for both software architecture and code. The evolution of TD techniques over the past years has led to a number of research and commercial tools. In addition, the increasing trend of opportunistic reuse (as opposed to systematic reuse), where developers reuse code assets in popular repositories, is changing the way components are selected and integrated into existing systems. However, reusing software opportunistically can lead to a loss of quality and induce TD, especially when the architecture is changed in the process. However, to the best of our knowledge, no studies have investigated the impact of opportunistic reuse in TD. In this paper, we carry out an exploratory study to investigate to what extent reusing components opportunistically negatively affects the quality of systems. We use one commercial and one research tool to analyze the TD ratios of three case systems, before and after opportunistically extending them with open-source software.

https://conf.researchr.org/resetPassword/icse-2021/d617d0fe-f66b-4de6-b6ba-36573befeafc (Capilla-TD-Oppo-Reuse.pdf)509KiB

Conference Day
Wed 19 May

Displayed time zone: Amsterdam, Berlin, Bern, Rome, Stockholm, Vienna change

17:00 - 17:50
TD Characteristics and ContextsTechnical Papers at TechDebt Room
Chair(s): Apostolos AmpatzoglouUniversity of Macedonia
Frequency and Impact of Technical Debt Characteristics in Companies Producing Mechatronic Products
Technical Papers
Fandi BiTechnical University of Munich, Birgit Vogel-HeuserKarlsruhe Institute of Technology, Litong Xu
Pre-print Media Attached File Attached
Impact of Opportunistic Reuse Practices to Technical Debt
Technical Papers
Rafael CapillaUniversidad Rey Juan Carlos, Tommi MikkonenUniversity of Helsinki, Carlos CarrilloTechnical University of Madrid, Francesca Arcelli FontanaUniversity of Milano - Bicocca, Ilaria PigazziniUniversity of Milano-Bicocca, Valentina LenarduzziLUT University
File Attached
Security Debt: Characteristics, Product Life-Cycle Integrations and Items
Technical Papers

Information for Participants
Info for TechDebt Room: