Call for Tools
The 4th International Conference on Technical Debt will be held virtually (originally in Madrid, Spain), on May 19-21, 2021, collocated with ICSE 2021.
Technical debt is a metaphor that software developers and managers increasingly use to communicate key trade-offs between time to market and quality issues.
While other software engineering disciplines—such as software maintenance and evolution, refactoring, software quality, and empirical software engineering—have produced results relevant to managing technical debt, none of them alone suffice to model, manage, and communicate the different facets of the design trade-off problems involved in managing technical debt. Similarly, while many software engineering practices can be used to get ahead of technical debt, organizations struggle with managing technical debt routinely and strategically.
Tools play a critical role in understanding the management, monitoring, and measurement of technical debt in real-world situations. We invite researchers, practitioners and organizations to showcase new techniques, methods, and tools that can aid practitioners and decision makers in these critical tasks to participate in TechDebt 2021.
Submission types
Tools track accepts two types of submissions:
- Tool presentation papers (up to 5 pages): describe innovative and original tools addressing technical debt issues or aiming at the management of technical debt. Submitted tool papers will be peer-reviewed and accepted submissions will be published in the conference proceedings.
- Extended abstract (1-2 pages): describe innovative and original initial tools idea for which there is not yet a prototype in order to obtain early feedback. Extended abstracts provide practitioners with an opportunity to showcase a tool-specific perspective. Extended abstracts are not peer reviewed and will not be published in the conference proceedings.
Suggested content for both types of submissions, the program committee and chairs will look for:
- The alignment to the overarching technical debt theme of the conference.
- How the purpose of the tool is addressed and how validation experiences with practitioners have been planned or conducted (if applicable)
Submission process
In EasyChair, on top of specifying the type of submission, indicate how you will participate in the conference session (you may select one or both):
- Panel participant: In the panel discussion we will engage participants and the audience on how the showcased tools help address technical debt challenges.
- Tool demonstration: If you propose to showcase your tool or product from your organization, please let us know your requirements *(such as space, equipment, …). A dedicated demo session will be part of the Tools track.
All accepted papers will also have the possibility to bring a poster during the conference.
Papers and extended abstract must be submitted electronically via the TechDebtConf2021 EasyChair site. Submissions must be in PDF and conform to the ACM formatting guidelines applied for ICSE 2021. Submissions may not exceed the number of pages specified above (including all text, references and figures). Purchases of additional pages in the proceedings are not allowed.
Formatting instructions are available at https://www.acm.org/publications/proceedings-template for both LaTeX and Word users.
The official publication date is the date the proceedings are made available in the ACM or IEEE Digital Libraries. This date may be up to two weeks prior to the first day of ICSE 2021. The official publication date affects the deadline for any patent filings related to published work.
Accepted papers must be presented in person at the conference by one of the authors. Accepted submissions will be published as part of the ICSE co-located events proceedings.
Important dates
January 27January 31, 2021: Tool presentation papers (up to 5 pages) (extended)- February 24, 2021: Notification of acceptance or rejection
- March 22, 2021: Camera-ready papers
- March 30, 2021: Extended abstracts (up to 2 pages)
- April 10, 2021: Notification of acceptance or rejection for Extended abstracts
- May 23–24, 2021: TechDebt Conference
Further inquiries
All inquiries may be directed to track chairs:
Marcus Ciolkowski: marcus.ciolkowski@qaware.de
Valentina Lenarduzzi: valentina.lenarduzzi@lut.fi
Wed 19 MayDisplayed time zone: Amsterdam, Berlin, Bern, Rome, Stockholm, Vienna change
16:00 - 16:50 | Opening + TD Management - 1Technical Papers / Tools at TechDebt Room Chair(s): Maria Teresa Baldassarre Department of Computer Science, University of Bari | ||
16:00 10mDay opening | Conference Opening Technical Papers Antonio Martini University of Oslo, Norway Media Attached | ||
16:10 20mFull-paper | Business-Driven Technical Debt Prioritization: An Industrial Case Study Technical Papers Rodrigo Rebouças de Almeida Federal University of Paraiba, Rafael do Nascimento Ribeiro Universidade Federal do Rio Grande do Norte - UFRN, Christoph Treude University of Adelaide, Uirá Kulesza Federal University of Rio Grande do Norte Pre-print Media Attached | ||
16:30 20mFull-paper | Preventing Technical Debt by Technical Debt Aware Project Management - Evaluation of a Framework for Managing Technical Debt Developed by Practitioners Technical Papers Marion Wiese Universität Hamburg, MIN Fakultät, FB Informatik, Matthias Riebisch Universität Hamburg, MIN Fakultät, FB Informatik, Julian Schwarze Gruner + Jahr GmbH Pre-print Media Attached |
18:00 - 19:20 | Industrial PanelTechnical Papers / Tools at TechDebt Room Chair(s): Carolyn Seaman University of Maryland Baltimore County | ||
18:00 10mTalk | A Decision Support System Towards a Systemic Perspective on Technical Debt Management Technical Papers Media Attached | ||
18:10 60mOther | Industrial Panel Technical Papers S: Florian Deissenboeck CQSE GmbH, Jan Bosch Chalmers University of Technology, S: Ramsés Gallego Micro Focus, S: Robert Lagerstedt Robert Bosch AB, S: Rodrigo Rebouças de Almeida Federal University of Paraiba Media Attached | ||
19:10 10mShort-paper | Architectural Archipelagos: Technical Debt in Long-Lived Software Research Platforms Technical Papers Marcelo Schmitt Laser University of Southern California, USA, Duc Minh Le Bloomberg, USA, Joshua Garcia University of California, Irvine, Nenad Medvidović University of Southern California, USA Pre-print Media Attached |
Thu 20 MayDisplayed time zone: Amsterdam, Berlin, Bern, Rome, Stockholm, Vienna change
16:00 - 16:50 | |||
16:00 50mKeynote | Technical Debt in the Age of Ops Technical Papers Media Attached |
17:00 - 17:40 | Smells, Patterns and Metrics - 1Technical Papers at TechDebt Room Chair(s): Juan Garbajosa Technical University of Madrid | ||
17:00 20mFull-paper | Experiences on Managing Technical Debt with Code Smells and AntiPatterns Technical Papers Jacinto Ramirez Lahti Solita Ltd, Finland, Antti-Pekka Tuovinen University of Helsinki, Tommi Mikkonen University of Helsinki Pre-print Media Attached | ||
17:20 20mFull-paper | Worst Smells and Their Worst Reasons Technical Papers Pre-print Media Attached |
17:40 - 18:20 | |||
17:40 40mSocial Event | Social Event Technical Papers Media Attached |
18:20 - 19:00 | Smells, Patterns and Metrics - 2 Technical Papers at TechDebt Room Chair(s): Valentina Lenarduzzi LUT University | ||
18:20 20mFull-paper | Predicting Relative Thresholds for Object Oriented Metrics Technical Papers Sultan Alhusain Saudi Electronic University Pre-print Media Attached File Attached | ||
18:40 20mFull-paper | Characterizing Technical Debt and Antipatterns in AI-Based Systems: A Systematic Literature Review Technical Papers Justus Bogner University of Stuttgart, Institute of Software Engineering, Empirical Software Engineering Group, Roberto Verdecchia Vrije Universiteit Amsterdam, Ilias Gerostathopoulos Vrije Universiteit Amsterdam Pre-print Media Attached |
Fri 21 MayDisplayed time zone: Amsterdam, Berlin, Bern, Rome, Stockholm, Vienna change
16:00 - 16:50 | |||
16:00 50mKeynote | The Product Owner who Didn't Break my Window and Disappeared - An Experience Report on Managing Technical Debt in Agile Contexts Technical Papers Marcus Ciolkowski QAware Media Attached |
17:00 - 17:50 | TD Management - 2Technical Papers at TechDebt Room Chair(s): Rafael Capilla Universidad Rey Juan Carlos | ||
17:00 20mFull-paper | Carrot and Stick approaches revisited when managing Technical Debt in an educational/training context Technical Papers Yania Crespo University of Valladolid, arturo gonzalez University of Valladolid, Mario Piattini University of Castilla-La Mancha, Spain Pre-print Media Attached | ||
17:20 10mShort-paper | The Need for Holistic Technical Debt Management across the Value Stream: Lessons Learnt and Open Challenges Technical Papers Somayeh Malakuti ABB Corporate Research, Germany, Jens Heuschkel ABB Corporate Research Center, Germany Pre-print Media Attached | ||
17:30 20mFull-paper | Assessing Smart Contracts Security Technical Debts Technical Papers Sabreen Ahmadjee University of Birmingham, Carlos Mera-Gómez ESPOL Polythecnic University, Rami Bahsoon School of Computer Science, University of Birmingham Pre-print Media Attached |
18:00 - 19:30 | Working session, awards and closingTechnical Papers / Tools at TechDebt Room Chair(s): Antonio Martini University of Oslo, Norway | ||
18:00 90mOther | Working session, awards and closing Technical Papers Antonio Martini University of Oslo, Norway, Davide Taibi Tampere University , Narayan Ramasubbu University of Pittsburgh, USA Media Attached |