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TechDebt 2021
Wed 19 - Fri 21 May 2021
co-located with ICSE 2021
Wed 19 May 2021 17:40 - 17:50 at TechDebt Room - TD Characteristics and Contexts Chair(s): Apostolos Ampatzoglou

Industries from very diverse domains are realising that security should not be treated in a reactive way (e.g., once the cyberattack has happened). This way, security-related requirements and risks need to be continuously managed, and the need of integrating technical measures should be continuously assessed. In some cases, some decisions led, intentionally or unintentionally, to debt related to security aspects. This security debt is thus incurred when limited approaches or solutions are applied to reach the expected security levels of the system in operation. Identifying and making explicit security debt items is a challenge for companies. In this work, we analyse the literature on security debt to provide initial insights on the topic. Concretely, we discuss its definition, identify its most salient characteristics, present approaches for integrating its management in the product life-cycle, and to present categories and examples of security debt items.

Wed 19 May

Displayed time zone: Amsterdam, Berlin, Bern, Rome, Stockholm, Vienna change

17:00 - 17:50
TD Characteristics and ContextsTechnical Papers at TechDebt Room
Chair(s): Apostolos Ampatzoglou University of Macedonia
Frequency and Impact of Technical Debt Characteristics in Companies Producing Mechatronic Products
Technical Papers
Fandi Bi Technical University of Munich, Birgit Vogel-Heuser Karlsruhe Institute of Technology, Litong Xu
Pre-print Media Attached File Attached
Impact of Opportunistic Reuse Practices to Technical Debt
Technical Papers
Rafael Capilla Universidad Rey Juan Carlos, Tommi Mikkonen University of Helsinki, Carlos Carrillo Technical University of Madrid, Francesca Arcelli Fontana University of Milano - Bicocca, Ilaria Pigazzini University of Milano-Bicocca, Valentina Lenarduzzi LUT University
Media Attached File Attached
Security Debt: Characteristics, Product Life-Cycle Integrations and Items
Technical Papers
Jabier Martinez Tecnalia, Nuria Quintano Tecnalia, Alejandra Ruiz Tecnalia, Izaskun Santamaria Tecnalia, Iker Martinez de Soria Tecnalia, José Arias Tecnalia
Pre-print Media Attached

Information for Participants
Wed 19 May 2021 17:00 - 17:50 at TechDebt Room - TD Characteristics and Contexts Chair(s): Apostolos Ampatzoglou
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