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TechDebt 2021
Wed 19 - Fri 21 May 2021
co-located with ICSE 2021
Dates
Tracks
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Wed 19 May

Displayed time zone: Amsterdam, Berlin, Bern, Rome, Stockholm, Vienna change

16:00 - 16:50
Opening + TD Management - 1Technical Papers / Tools at TechDebt Room
Chair(s): Maria Teresa Baldassarre Department of Computer Science, University of Bari
16:00
10m
Day opening
Conference Opening
Technical Papers
Antonio Martini University of Oslo, Norway
Media Attached
16:10
20m
Full-paper
Business-Driven Technical Debt Prioritization: An Industrial Case Study
Technical Papers
Rodrigo Rebouças de Almeida Federal University of Paraiba, Rafael do Nascimento Ribeiro Universidade Federal do Rio Grande do Norte - UFRN, Christoph Treude University of Adelaide, Uirá Kulesza Federal University of Rio Grande do Norte
Pre-print Media Attached
16:30
20m
Full-paper
Preventing Technical Debt by Technical Debt Aware Project Management - Evaluation of a Framework for Managing Technical Debt Developed by Practitioners
Technical Papers
Marion Wiese Universität Hamburg, MIN Fakultät, FB Informatik, Matthias Riebisch Universität Hamburg, MIN Fakultät, FB Informatik, Julian Schwarze Gruner + Jahr GmbH
Pre-print Media Attached
17:00 - 17:50
TD Characteristics and ContextsTechnical Papers at TechDebt Room
Chair(s): Apostolos Ampatzoglou University of Macedonia
17:00
20m
Full-paper
Frequency and Impact of Technical Debt Characteristics in Companies Producing Mechatronic Products
Technical Papers
Fandi Bi Technical University of Munich, Birgit Vogel-Heuser Karlsruhe Institute of Technology, Litong Xu
Pre-print Media Attached File Attached
17:20
20m
Full-paper
Impact of Opportunistic Reuse Practices to Technical Debt
Technical Papers
Rafael Capilla Universidad Rey Juan Carlos, Tommi Mikkonen University of Helsinki, Carlos Carrillo Technical University of Madrid, Francesca Arcelli Fontana University of Milano - Bicocca, Ilaria Pigazzini University of Milano-Bicocca, Valentina Lenarduzzi LUT University
Media Attached File Attached
17:40
10m
Short-paper
Security Debt: Characteristics, Product Life-Cycle Integrations and Items
Technical Papers
Jabier Martinez Tecnalia, Nuria Quintano Tecnalia, Alejandra Ruiz Tecnalia, Izaskun Santamaria Tecnalia, Iker Martinez de Soria Tecnalia, José Arias Tecnalia
Pre-print Media Attached
18:00 - 19:20
Industrial PanelTechnical Papers / Tools at TechDebt Room
Chair(s): Carolyn Seaman University of Maryland Baltimore County
18:00
10m
Talk
A Decision Support System Towards a Systemic Perspective on Technical Debt Management
Technical Papers
Media Attached
18:10
60m
Other
Industrial Panel
Technical Papers
S: Florian Deissenboeck CQSE GmbH, Jan Bosch Chalmers University of Technology, S: Ramsés Gallego Micro Focus, S: Robert Lagerstedt Robert Bosch AB, S: Rodrigo Rebouças de Almeida Federal University of Paraiba
Media Attached
19:10
10m
Short-paper
Architectural Archipelagos: Technical Debt in Long-Lived Software Research Platforms
Technical Papers
Marcelo Schmitt Laser University of Southern California, USA, Duc Minh Le Bloomberg, USA, Joshua Garcia University of California, Irvine, Nenad Medvidović University of Southern California, USA
Pre-print Media Attached

Thu 20 May

Displayed time zone: Amsterdam, Berlin, Bern, Rome, Stockholm, Vienna change

16:00 - 16:50
KeynoteTechnical Papers at TechDebt Room
Chair(s): Alexander Chatzigeorgiou University of Macedonia
16:00
50m
Keynote
Technical Debt in the Age of Ops
Technical Papers
K: Jan Bosch Chalmers University of Technology
Media Attached
17:00 - 17:40
Smells, Patterns and Metrics - 1Technical Papers at TechDebt Room
Chair(s): Juan Garbajosa Technical University of Madrid
17:00
20m
Full-paper
Experiences on Managing Technical Debt with Code Smells and AntiPatterns
Technical Papers
Jacinto Ramirez Lahti Solita Ltd, Finland, Antti-Pekka Tuovinen University of Helsinki, Tommi Mikkonen University of Helsinki
Pre-print Media Attached
17:20
20m
Full-paper
Worst Smells and Their Worst Reasons
Technical Papers
Davide Falessi California Polytechnic State University, Rick Kazman University of Hawai‘i at Mānoa
Pre-print Media Attached
17:40 - 18:20
Social EventTechnical Papers at TechDebt Room
Chair(s): Antonio Martini University of Oslo, Norway
17:40
40m
Social Event
Social Event
Technical Papers

Media Attached
18:20 - 19:00
Smells, Patterns and Metrics - 2 Technical Papers at TechDebt Room
Chair(s): Valentina Lenarduzzi LUT University
18:20
20m
Full-paper
Predicting Relative Thresholds for Object Oriented Metrics
Technical Papers
Sultan Alhusain Saudi Electronic University
Pre-print Media Attached File Attached
18:40
20m
Full-paper
Characterizing Technical Debt and Antipatterns in AI-Based Systems: A Systematic Literature Review
Technical Papers
Justus Bogner University of Stuttgart, Institute of Software Engineering, Empirical Software Engineering Group, Roberto Verdecchia Vrije Universiteit Amsterdam, Ilias Gerostathopoulos Vrije Universiteit Amsterdam
Pre-print Media Attached

Fri 21 May

Displayed time zone: Amsterdam, Berlin, Bern, Rome, Stockholm, Vienna change

17:00 - 17:50
TD Management - 2Technical Papers at TechDebt Room
Chair(s): Rafael Capilla Universidad Rey Juan Carlos
17:00
20m
Full-paper
Carrot and Stick approaches revisited when managing Technical Debt in an educational/training context
Technical Papers
Yania Crespo University of Valladolid, arturo gonzalez University of Valladolid, Mario Piattini University of Castilla-La Mancha, Spain
Pre-print Media Attached
17:20
10m
Short-paper
The Need for Holistic Technical Debt Management across the Value Stream: Lessons Learnt and Open Challenges
Technical Papers
Somayeh Malakuti ABB Corporate Research, Germany, Jens Heuschkel ABB Corporate Research Center, Germany
Pre-print Media Attached
17:30
20m
Full-paper
Assessing Smart Contracts Security Technical Debts
Technical Papers
Sabreen Ahmadjee University of Birmingham, Carlos Mera-Gómez ESPOL Polythecnic University, Rami Bahsoon School of Computer Science, University of Birmingham
Pre-print Media Attached
18:00 - 19:30
Working session, awards and closingTechnical Papers / Tools at TechDebt Room
Chair(s): Antonio Martini University of Oslo, Norway
18:00
90m
Other
Working session, awards and closing
Technical Papers
Antonio Martini University of Oslo, Norway, Davide Taibi Tampere University , Narayan Ramasubbu University of Pittsburgh, USA
Media Attached

Not scheduled yet

Not scheduled yet
Break
Break
Technical Papers

Call for Papers

Madrid

The 4th International Conference on Technical Debt (TechDebt 2021) will be held virtually (originally in Madrid, Spain) on May 19–21, 2021. As in previous editions TechDebt will be collocated with the 43rd International Conference on Software Engineering (ICSE 2021).

According to the Dagstuhl seminar 16162 definition “In software-intensive systems, technical debt is a collection of design or implementation constructs that are expedient in the short term, but set up a technical context that can make future changes more costly or impossible. Technical debt presents an actual or contingent liability whose impact is limited to internal system qualities, primarily maintainability and evolvability.”

The International Conference on Technical Debt provides a forum for practitioners and researchers to discuss research results and empirical findings related to Technical Debt and to share best practices and lessons learned in software development organizations. Acknowledging that Technical Debt is a multifaceted challenge faced daily by software professionals, the Technical Debt community promotes a healthy and collaborative partnership between academics and practitioners welcoming industrial studies and advances in tools.

TechDebt 2021 aims to bring together leading software engineering researchers and practitioners to discuss approaches for managing various types of Technical Debt, to share experiences and best practices and to identify key challenges for industry and academia.

Topics of interest include, but are not limited to:

  • Technical debt management and decision making
  • Tools and indicators for identifying technical debt
  • Technical debt in various software domains and development contexts
  • Novel types of technical debt
  • Replications and secondary studies of technical debt
  • Technical debt remediation strategies, methods, and tools
  • Conceptual frameworks for technical debt
  • Experiences, approaches and tools for teaching technical debt topics in academic courses or industrial training

We invite submissions of papers to the Technical Track in any areas related to the theme and goal of the conference in the following categories:

  • Research Papers (up to 10 pages): innovative and significant original research in the field
  • Experience Papers (up to 10 pages): industrial experience, case studies, challenges, problems, and solutions
  • Short Papers (up to 5 pages): position and future trend papers describing ongoing research or new results, descriptions or examples of problems and solutions in real-life settings that pose fundamental or characteristic challenges.

If you would like to submit a tool demo or description of a tool (either to complement your submission to the Technical Track or as a separate submission), please refer to the Tools Track of TechDebt 2021.

Submissions must be original and unpublished work. Each paper submitted to the main Technical Track will undergo a rigorous review process by at least three members of the program committee.

TechDebt 2021 adopts a double-blind review process for the main Technical Track (only). Therefore, all submissions to this track have to fulfill the double-blind reviewing requirements. Any submission that does not comply with these requirements may be desk-rejected without further review.

Evaluation criteria:

  • Relevance: Submission must respond to Call for Papers.
  • Novelty: Is there sufficient originality in the contribution, and is it clearly and correctly explained with respect to the state of the art?
  • Soundness: Are all claimed contributions supported by the rigorous application of appropriate research methods? Claims should be scoped to what can be supported, and limitations should be discussed.
  • Significance: Are contributions evaluated for their importance and impact with respect to the existing body of knowledge? The authors are expected to explicitly argue for the relevance and usefulness of the research and discuss the novelty of the claimed contributions through a comparison with pertinent related work.
  • Replicability: Is there sufficient information in the paper for the results to be independently replicated? The evaluation of submissions will take into account the extent to which sufficient information is available to support the full or partial independent replication of the claimed findings.
  • Presentation Quality: Are results clearly presented? Submissions are expected to meet high standards of presentation, including adequate use of the English language, absence of major ambiguity, clearly readable figures and tables, and respect of the formatting instructions.

The weighting and relevance of the above criteria varies for paper types.

Papers must be submitted electronically via the TechDebtConf2021 EasyChair site. Submissions must be in PDF and conform to the ACM formatting guidelines applied for ICSE 2021. Submissions may not exceed the number of pages specified above (including all text, references and figures). Purchase of additional pages in the proceedings is not allowed.

Formatting instructions are available at https://www.acm.org/publications/proceedings-template for both LaTeX and Word users. The official publication date is the date the proceedings are made available in the ACM or IEEE Digital Libraries. This date may be up to two weeks prior to the first day of ICSE 2021. The official publication date affects the deadline for any patent filings related to published work.

A selection of best papers will be invited to submit extended versions for tentative publication in a Special Section of the journal of Information and Software Technology published by Elsevier http://www.elsevier.com/locate/infsof.

Important dates:

  • January 12 January 22, 2021: Research and Experience Paper submission deadline to EasyChair (extended)
  • January 27 January 31, 2021: Short Paper submission deadline to EasyChair (extended)
  • February 22 February 27, 2021: Notification to authors (updated)
  • March 22, 2021: Camera-ready papers
  • May 19–21, 2021: TechDebt Conference

Accepted Papers

Title
A Decision Support System Towards a Systemic Perspective on Technical Debt Management
Technical Papers
Media Attached
Architectural Archipelagos: Technical Debt in Long-Lived Software Research Platforms
Technical Papers
Pre-print Media Attached
Assessing Smart Contracts Security Technical Debts
Technical Papers
Pre-print Media Attached
Break
Technical Papers

Business-Driven Technical Debt Prioritization: An Industrial Case Study
Technical Papers
Pre-print Media Attached
Carrot and Stick approaches revisited when managing Technical Debt in an educational/training context
Technical Papers
Pre-print Media Attached
Characterizing Technical Debt and Antipatterns in AI-Based Systems: A Systematic Literature Review
Technical Papers
Pre-print Media Attached
Conference Opening
Technical Papers
Media Attached
Experiences on Managing Technical Debt with Code Smells and AntiPatterns
Technical Papers
Pre-print Media Attached
Frequency and Impact of Technical Debt Characteristics in Companies Producing Mechatronic Products
Technical Papers
Pre-print Media Attached File Attached
Impact of Opportunistic Reuse Practices to Technical Debt
Technical Papers
Media Attached File Attached
Predicting Relative Thresholds for Object Oriented Metrics
Technical Papers
Pre-print Media Attached File Attached
Preventing Technical Debt by Technical Debt Aware Project Management - Evaluation of a Framework for Managing Technical Debt Developed by Practitioners
Technical Papers
Pre-print Media Attached
Security Debt: Characteristics, Product Life-Cycle Integrations and Items
Technical Papers
Pre-print Media Attached
The Need for Holistic Technical Debt Management across the Value Stream: Lessons Learnt and Open Challenges
Technical Papers
Pre-print Media Attached
Worst Smells and Their Worst Reasons
Technical Papers
Pre-print Media Attached