TechDebt 2021 Contributors

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Results (98)

A Sabreen AhmadjeeAhmadjee, Sabreen University of BirminghamUnited Kingdom Assessing Smart Contracts Security Technical Debts
Sultan AlhusainAlhusain, Sultan Saudi Electronic UniversitySaudi Arabia Predicting Relative Thresholds for Object Oriented Metrics
Esra AlzaghoulAlzaghoul, Esra University of Jordan PC Member in Programme Committee within the TechDebt Technical Papers-track
Apostolos AmpatzoglouAmpatzoglou, Apostolos University of MacedoniaGreece Proceedings Chair in Organizing Committee for TechDebt 2021 Session Chair of TD Characteristics and Contexts (part of TechDebt Technical Papers) PC Member in Programme Committee within the TechDebt Technical Papers-track
Areti AmpatzoglouAmpatzoglou, Areti University of Groningen PC Member in Programme Committee within the TechDebt Technical Papers-track
Nicolas AnquetilAnquetil, Nicolas University of Lille, Lille, FranceFrance PC Member in Programme Committee within the TechDebt Technical Papers-track
Francesca Arcelli FontanaArcelli Fontana, Francesca University of Milano - BicoccaItaly Impact of Opportunistic Reuse Practices to Technical Debt PC Member in Programme Committee within the TechDebt Technical Papers-track
José AriasArias, José TecnaliaSpain Security Debt: Characteristics, Product Life-Cycle Integrations and Items
Paris AvgeriouAvgeriou, Paris University of Groningen, The NetherlandsNetherlands Committee Member in Steering Committee for TechDebt 2021 PC Member in Programme Committee within the TechDebt Technical Papers-track
B Rami BahsoonBahsoon, Rami School of Computer Science, University of Birmingham Assessing Smart Contracts Security Technical Debts PC Member in Programme Committee within the TechDebt Technical Papers-track
Maria Teresa BaldassarreBaldassarre, Maria Teresa Department of Computer Science, University of Bari Italy Publicity Chair in Organizing Committee for TechDebt 2021 Session Chair of Opening + TD Management - 1 (part of TechDebt Technical Papers)
Stephany BellomoBellomo, Stephany Software Engineering Institute PC Member in Programme Committee within the TechDebt Technical Papers-track
Terese BeskerBesker, Terese Chalmers University of Technology, SwedenSweden PC Member in Programme Committee within the TechDebt Technical Papers-track
Fandi BiBi, Fandi Technical University of MunichGermany Frequency and Impact of Technical Debt Characteristics in Companies Producing Mechatronic Products
Xavier BlancBlanc, Xavier Université de BordeauxFrance PC Member in Programme Committee within the TechDebt Technical Papers-track
Justus BognerBogner, Justus University of Stuttgart, Institute of Software Engineering, Empirical Software Engineering GroupGermany Characterizing Technical Debt and Antipatterns in AI-Based Systems: A Systematic Literature Review
Jan BoschBosch, Jan Chalmers University of TechnologySweden Industrial Panel Technical Debt in the Age of Ops PC Member in Programme Committee within the TechDebt Technical Papers-track
C Rafael CapillaCapilla, Rafael Universidad Rey Juan CarlosSpain Local Co-Chair in Organizing Committee for TechDebt 2021 Session Chair of TD Management - 2 (part of TechDebt Technical Papers) Impact of Opportunistic Reuse Practices to Technical Debt
Carlos CarrilloCarrillo, Carlos Technical University of MadridSpain Impact of Opportunistic Reuse Practices to Technical Debt
Alexander ChatzigeorgiouChatzigeorgiou, Alexander University of MacedoniaGreece Program Co-Chair in Organizing Committee for TechDebt 2021 Session Chair of Keynote (part of TechDebt Technical Papers)
Marcus CiolkowskiCiolkowski, Marcus QAwareGermany Tool Co-Chair in Organizing Committee for TechDebt 2021 The Product Owner who Didn't Break my Window and Disappeared - An Experience Report on Managing Technical Debt in Agile Contexts
Zadia CodabuxCodabux, Zadia University of Saskatchewan Virtualisation Chair in Organizing Committee for TechDebt 2021 PC Member in Programme Committee within the TechDebt Technical Papers-track
Yania CrespoCrespo, Yania University of ValladolidSpain Carrot and Stick approaches revisited when managing Technical Debt in an educational/training context
D Remco de Boerde Boer, Remco ArchiXL PC Member in Programme Committee within the TechDebt Technical Papers-track
Florian DeissenboeckDeissenboeck, Florian CQSE GmbHGermany Industrial Panel PC Member in Programme Committee within the TechDebt Tools-track
Marco di Biasedi Biase, Marco Software Improvement Group / Delft University of TechnologyNetherlands PC Member in Programme Committee within the TechDebt Tools-track
Rafael do Nascimento Ribeirodo Nascimento Ribeiro, Rafael Universidade Federal do Rio Grande do Norte - UFRNBrazil Business-Driven Technical Debt Prioritization: An Industrial Case Study
E Neil ErnstErnst, Neil University of VictoriaCanada PC Member in Programme Committee within the TechDebt Technical Papers-track
F Davide FalessiFalessi, Davide California Polytechnic State UniversityUnited States Worst Smells and Their Worst Reasons
Daniel FeitosaFeitosa, Daniel University of GroningenNetherlands Web Chair in Organizing Committee for TechDebt 2021
Michael FeldererFelderer, Michael University of InnsbruckAustria PC Member in Programme Committee within the TechDebt Technical Papers-track
Qiong FengFeng, Qiong Drexel University PC Member in Programme Committee within the TechDebt Technical Papers-track
Eduardo FrancoFranco, Eduardo A Decision Support System Towards a Systemic Perspective on Technical Debt Management
G Ramsés GallegoGallego, Ramsés Micro FocusSpain Industrial Panel
Matthias GalsterGalster, Matthias University of CanterburyNew Zealand PC Member in Programme Committee within the TechDebt Technical Papers-track
Juan GarbajosaGarbajosa, Juan Technical University of MadridSpain Local Co-Chair in Organizing Committee for TechDebt 2021 Session Chair of Smells, Patterns and Metrics - 1 (part of TechDebt Technical Papers) PC Member in Programme Committee within the TechDebt Technical Papers-track
Joshua GarciaGarcia, Joshua University of California, IrvineUnited States Architectural Archipelagos: Technical Debt in Long-Lived Software Research Platforms
Ilias GerostathopoulosGerostathopoulos, Ilias Vrije Universiteit AmsterdamNetherlands Characterizing Technical Debt and Antipatterns in AI-Based Systems: A Systematic Literature Review
Javier Gonzalez HuertaGonzalez Huerta, Javier Blekinge Institute of Technology PC Member in Programme Committee within the TechDebt Technical Papers-track
arturo gonzalezgonzalez, arturo University of ValladolidSpain Carrot and Stick approaches revisited when managing Technical Debt in an educational/training context
Liliana GuzmanGuzman, Liliana DSA PC Member in Programme Committee within the TechDebt Tools-track
H Jens HeuschkelHeuschkel, Jens ABB Corporate Research Center, GermanyGermany The Need for Holistic Technical Debt Management across the Value Stream: Lessons Learnt and Open Challenges
I Clemente IzurietaIzurieta, Clemente Montana State UniversityUnited States PC Member in Programme Committee within the TechDebt Technical Papers-track
J Andrea JanesJanes, Andrea Free University of Bozen-BolzanoItaly PC Member in Programme Committee within the TechDebt Tools-track
Sven JohannJohann, Sven innoQ PC Member in Programme Committee within the TechDebt Technical Papers-track
K Rick KazmanKazman, Rick University of Hawai‘i at Mānoa Worst Smells and Their Worst Reasons
Heiko KoziolekKoziolek, Heiko ABB Corporate ResearchGermany PC Member in Programme Committee within the TechDebt Technical Papers-track
Philippe KruchtenKruchten, Philippe University of British ColumbiaCanada Committee Member in Steering Committee for TechDebt 2021 PC Member in Programme Committee within the TechDebt Technical Papers-track
Uirá KuleszaKulesza, Uirá Federal University of Rio Grande do NorteBrazil Business-Driven Technical Debt Prioritization: An Industrial Case Study
L Robert LagerstedtLagerstedt, Robert Robert Bosch ABSweden Industrial Panel
Duc Minh LeLe, Duc Minh Bloomberg, USAUnited Kingdom Architectural Archipelagos: Technical Debt in Long-Lived Software Research Platforms
Valentina LenarduzziLenarduzzi, Valentina LUT University Finland Tool Co-Chair in Organizing Committee for TechDebt 2021 Session Chair of Smells, Patterns and Metrics - 2 (part of TechDebt Technical Papers) Impact of Opportunistic Reuse Practices to Technical Debt PC Member in Programme Committee within the TechDebt Technical Papers-track
Ville LeppänenLeppänen, Ville University of Turku, Department of Future Technologies PC Member in Programme Committee within the TechDebt Technical Papers-track
Peng LiangLiang, Peng Wuhan UniversityChina PC Member in Programme Committee within the TechDebt Technical Papers-track
M Somayeh MalakutiMalakuti, Somayeh ABB Corporate Research, GermanyGermany The Need for Holistic Technical Debt Management across the Value Stream: Lessons Learnt and Open Challenges
Vladimir MandićMandić, Vladimir Faculty of Technical Sciences, University of Novi SadSerbia PC Member in Programme Committee within the TechDebt Technical Papers-track
Iker Martinez de SoriaMartinez de Soria, Iker TecnaliaSpain Security Debt: Characteristics, Product Life-Cycle Integrations and Items
Jabier MartinezMartinez, Jabier TecnaliaSpain Security Debt: Characteristics, Product Life-Cycle Integrations and Items
Antonio MartiniMartini, Antonio University of Oslo, NorwayNorway General Chair in Organizing Committee for TechDebt 2021 Session Chair of Working session, awards and closing (part of TechDebt Technical Papers) Session Chair of Keynote (part of TechDebt Technical Papers) Session Chair of Social Event (part of TechDebt Technical Papers) Conference Opening Working session, awards and closing
Nenad MedvidovićMedvidović, Nenad University of Southern California, USAUnited States Architectural Archipelagos: Technical Debt in Long-Lived Software Research Platforms
Andy MeneelyMeneely, Andy Rochester Institute of TechnologyUnited States PC Member in Programme Committee within the TechDebt Technical Papers-track
Carlos Mera-GómezMera-Gómez, Carlos ESPOL Polythecnic UniversityEcuador Assessing Smart Contracts Security Technical Debts
Tommi MikkonenMikkonen, Tommi University of Helsinki Experiences on Managing Technical Debt with Code Smells and AntiPatterns Impact of Opportunistic Reuse Practices to Technical Debt
Torvald MårtenssonMårtensson, Torvald Saab AB PC Member in Programme Committee within the TechDebt Tools-track
N Robert NordNord, Robert Software Engineering InstituteUnited States Committee Member in Steering Committee for TechDebt 2021
O Ipek OzkayaOzkaya, Ipek Carnegie Mellon Software Engineering InstituteUnited States Committee Member in Steering Committee for TechDebt 2021
P Jennifer PerezPerez, Jennifer Technical University of Madrid (UPM) PC Member in Programme Committee within the TechDebt Technical Papers-track
Mario PiattiniPiattini, Mario University of Castilla-La Mancha, SpainSpain Carrot and Stick approaches revisited when managing Technical Debt in an educational/training context
Ilaria PigazziniPigazzini, Ilaria University of Milano-BicoccaItaly Impact of Opportunistic Reuse Practices to Technical Debt
Q Nuria QuintanoQuintano, Nuria TecnaliaSpain Security Debt: Characteristics, Product Life-Cycle Integrations and Items
R Narayan RamasubbuRamasubbu, Narayan University of Pittsburgh, USA United States Working session, awards and closing
Jacinto Ramirez LahtiRamirez Lahti, Jacinto Solita Ltd, FinlandFinland Experiences on Managing Technical Debt with Code Smells and AntiPatterns
Rodrigo Rebouças de AlmeidaRebouças de Almeida, Rodrigo Federal University of ParaibaBrazil Business-Driven Technical Debt Prioritization: An Industrial Case Study Industrial Panel
Matthias RiebischRiebisch, Matthias Universität Hamburg, MIN Fakultät, FB InformatikGermany Preventing Technical Debt by Technical Debt Aware Project Management - Evaluation of a Framework for Managing Technical Debt Developed by Practitioners
Alejandra RuizRuiz, Alejandra TecnaliaSpain Security Debt: Characteristics, Product Life-Cycle Integrations and Items
S Izaskun SantamariaSantamaria, Izaskun TecnaliaSpain Security Debt: Characteristics, Product Life-Cycle Integrations and Items
Klaus SchmidSchmid, Klaus Stiftung University HildesheimGermany PC Member in Programme Committee within the TechDebt Technical Papers-track
Marcelo Schmitt LaserSchmitt Laser, Marcelo University of Southern California, USA Architectural Archipelagos: Technical Debt in Long-Lived Software Research Platforms
Julian SchwarzeSchwarze, Julian Gruner + Jahr GmbHGermany Preventing Technical Debt by Technical Debt Aware Project Management - Evaluation of a Framework for Managing Technical Debt Developed by Practitioners
Carolyn SeamanSeaman, Carolyn University of Maryland Baltimore CountyUnited States Program Co-Chair in Organizing Committee for TechDebt 2021 Committee Member in Steering Committee for TechDebt 2021 Session Chair of Industrial Panel (part of TechDebt Technical Papers)
Tushar SharmaSharma, Tushar Siemens ResearchUnited States PC Member in Programme Committee within the TechDebt Technical Papers-track
Rodrigo SpinolaSpinola, Rodrigo Universidade SalvadorBrazil PC Member in Programme Committee within the TechDebt Technical Papers-track
Daniel StåhlStåhl, Daniel Ericsson AB PC Member in Programme Committee within the TechDebt Tools-track
Harald StörrleStörrle, Harald QAware GmbH PC Member in Programme Committee within the TechDebt Tools-track
T Davide TaibiTaibi, Davide Tampere University Finland Working session, awards and closing PC Member in Programme Committee within the TechDebt Technical Papers-track
Damian Andrew TamburriTamburri, Damian Andrew TU/eNetherlands PC Member in Programme Committee within the TechDebt Technical Papers-track
Ewan TemperoTempero, Ewan University of AucklandNew Zealand PC Member in Programme Committee within the TechDebt Technical Papers-track
Christoph TreudeTreude, Christoph University of AdelaideAustralia Business-Driven Technical Debt Prioritization: An Industrial Case Study
Dimitrios TsoukalasTsoukalas, Dimitrios CERTH/ITIGreece PC Member in Programme Committee within the TechDebt Technical Papers-track
Antti-Pekka TuovinenTuovinen, Antti-Pekka University of HelsinkiFinland Experiences on Managing Technical Debt with Code Smells and AntiPatterns
V Roberto VerdecchiaVerdecchia, Roberto Vrije Universiteit AmsterdamNetherlands Characterizing Technical Debt and Antipatterns in AI-Based Systems: A Systematic Literature Review PC Member in Programme Committee within the TechDebt Technical Papers-track
Birgit Vogel-HeuserVogel-Heuser, Birgit Karlsruhe Institute of Technology Frequency and Impact of Technical Debt Characteristics in Companies Producing Mechatronic Products
W Marion WieseWiese, Marion Universität Hamburg, MIN Fakultät, FB InformatikGermany Preventing Technical Debt by Technical Debt Aware Project Management - Evaluation of a Framework for Managing Technical Debt Developed by Practitioners
Eoin WoodsWoods, Eoin EndavaUnited Kingdom PC Member in Programme Committee within the TechDebt Technical Papers-track
X Litong XuXu, Litong Frequency and Impact of Technical Debt Characteristics in Companies Producing Mechatronic Products
Y Heeran YounYoun, Heeran Samsung Electronics PC Member in Programme Committee within the TechDebt Technical Papers-track
Z Nico ZazworkaZazworka, Nico Elsevier Information Systems, Frankfurt, Germany PC Member in Programme Committee within the TechDebt Technical Papers-track
Uwe ZdunZdun, Uwe University of ViennaAustria PC Member in Programme Committee within the TechDebt Technical Papers-track